Locator: 44457APPLE.
Small outline integrated circuit package.
From an earlier post on the M5:
One advantage that the M5 could flaunt over predecessors is that it could employ TSMC’s Small Outline Integrated Circuit Packaging, or SoIC. This type of packaging was first introduced in 2018 and allows the stacking of chips in a three-dimensional structure, resulting in better thermal management, reduced current leakage, and better electrical performance compared to the two-dimensional chip design. The specifications of the M5 are currently unknown, but a move to the improved 3nm process can mean that Apple may have the liberty to add more performance cores, just like what it did with the M4.
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