Locator: 48999TECH.
DUV
The DUV (Deep Ultraviolet) lithography process in a semiconductor fab uses deep ultraviolet light (typically 193 nm) to print intricate patterns of chip layers onto silicon wafers, which are then processed through deposition, etching, and doping steps to build integrated circuits. The DUV process is a core, cost-effective component of chip manufacturing, involving coating wafers with photoresist, using a mask to transfer a circuit blueprint using DUV light, and then using that pattern to guide subsequent material deposition, etching, or doping.EUV
The EUV semiconductor fab process uses Extreme Ultraviolet (EUV) light to create smaller, more intricate patterns on silicon wafers, enabling advanced microchips. In this process, a high-energy laser hits molten tin droplets to generate 13.5nm EUV light. This light is then directed through a complex system of mirrors, which reflects the pattern from an EUV mask onto a photoresist-coated wafer. The EUV light exposes the photoresist, forming the desired circuit design, and the wafer is subsequently processed to etch the circuits into the silicon.
RISC-V
