Forbes, link here: why Intel's plans for a foundry may be in for a setback.
Intel is betting big on its 18A process, which it considers its most advanced yet, to turn around its foundry business. The process produces chips with technologies including RibbonFET gate-all-around transistors and PowerVia backside power delivery, which are expected to boost performance and power efficiency.
The chips using this process will be based on a 1.8-nanometer node size, putting Intel slightly ahead of TSMC’s N2 process which operates at a 2 nm node and is expected to arrive in the second half of 2025.
While TSMC claims that its N2 process will outperform Intel’s 18A in some crucial areas, such as SRAM density (enabling it to store more data in a smaller physical area), Intel’s 18A’s backside power delivery gives it a competitive edge with reduced power loss and better thermal performance. Good news on the new chip’s progress, or bad news if delays occur, could increase volatility in the stock.
