Thursday, April 9, 2026

CoWoS Has Become A Major Bottleck In The AI Hardware Supply Chain -- April 9, 2026

Locator: 50479CoWoS.

Pronounced "cows." Reminder, TeraFab will do this all under one roof. If it comes to fruition, TeraFab will be competing directly with all three stages of blade production: fabricating, packaging, and memory. 

This just popped up on x, link here:

Quick, update, is CoWoS a type of packaging?

Read the last line in the "box" below and then re-read Beth's note.

Now, the next obvious question:

Besides TSMC, who invented the technology, who else is using CoWoS / packaging. Obviously Apple is (through TSMC) but who else? Intel? Global Foundries? Samsung?

Reply:


CoWoS: search "CoWoS" on the blog, but in addition it is tracked over at "Tech." Or go direct here